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Facility size: 30,000 square feet

Process:
Thru-hole, S.M.T. & BGA configuration
printed circuit board assembly, board & system level
test services, system integration – dock to stock.

Printed Circuit Board Assembly Equipment:
3 each Printek II, 3-axis dual camera solder paste screen printer

1 MPM Ultraprint 3000

4 Amistar Place Pro 7100FV pick and
place machines with12 mil S.M.T. & 20 mil
BGA capability - at18k chip per hour
placement rates - from 0201 to 2.13 sq. capacity


2 Conceptronic Model HVA102 14 zone
high velocity forced air convection reflow ovens
with 18’ pin rail conveyors

1 Speedline Electrovert / Vectra with Opti-Flux
spray fluxer, 5 zone cal rod preheat, rotary chip
wave and vibrating Lambda wave

1 GPD Power Clean 4D in-line aqueous wash
system with 3 zone high pressure wash / rinse
and 2 zone rotary hot air knives

In Circuit Test:
Teradyne 1880 Z with in-house software /
test program development available

 

 

 
 
 

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